JTX N3 BGA Planting Tin Reballing Stencil Platform Set with BGA110 / BGA315 Stencil

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Price in points: 8 points
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Quantity 5+ 10+ 20+
Price 7.15 6.94 6.42

JTX N3 BGA Planting Tin Reballing Stencil Platform Set with BGA110 / BGA315 Stencil


Features:

  • NAND Reballing / Expansion Tools / Precise Alignment
  • More Powerful: Supports multiple NAND Reballing
  • Precise Alignment Efficient Operation: High Precision Nand Notch Efficient Reballing
  • Capacity Expansion Tools Specialized for Reballing: Nand Reballing mesh-laser drilled holes
  • Apple Reballing IC Soldering Platform: Apple Nand Reballing Platform
  • Built-in strong magnet, Tighten without falling off: Strong suction-no need for clips-easy to access
  • Easy to operate, Secure clamping
  • High Temperature Resistant: High Strength Dirt Resistant, Easy to Clean
  • Rubber Foot Mats: Wear-resistant, anti-slip, shock-absorbing, anti-pressure, anti-aging

Package includes:
  • 1 x Base

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